Nrog rau kev rov ua dua sai ntawm AI suav lub zog thiab nce qhov kev sib tw kub dissipation nyob rau hauv siab -kawg chips, ultra- siab thermal conductivity pob zeb diamond tau tshwm sim los ua cov khoom lag luam muaj txiaj ntsig zoo. Pob zeb diamond qhov tshwj xeeb thermal conductivity stems los ntawm nws cov microstructure tshwj xeeb, feem ntau cia siab rau cov lattice vibrations rau cua sov hloov. C-C bonds muaj zog heev ntawm carbon atoms, ua ke nrog me me atomic loj ntawm carbon, txwv atoms rau kev co nyob ze lub peev xwm tsawg kawg nkaus lub zog yam tsawg kawg nkaus -endowing pob zeb diamond nrog ib tug extraordinarily siab thermal conductivity. Meanwhile, tag nrho cov valence electrons nyob rau hauv pob zeb diamond koom nyob rau hauv kev sib raug zoo thiab tsis tuaj yeem txav mus los, muab nws zoo heev hluav taws xob rwb thaiv tsev. Qhov ob tus yam ntxwv ntawm "siab thermal conductivity + rwb thaiv tsev" ntxiv broadens nws daim ntawv thov.
Micron - los yog nanometer- nplai pob zeb diamond hmoov, tus cwj pwm los ntawm cov khoom siv loj me me, zoo -txhais morphology, siab purity, ob peb sab hauv tsis xws luag, thiab thermal conductivity siab heev, tuaj yeem muab tso rau hauv hlau- cov ntaub ntawv matrix siv los ua cov dab dej kub, cua sov- cov ntaub ntawv sib txuas ua haujlwm, thiab lwm yam. (TIMs) xws li thermal greases, thermal adhesives, thiab thermal pads.
Pob zeb diamond Micropowder Kev Npaj
Tam sim no, thawj txoj hauv kev tsim cov pob zeb diamond micropowder yog qhov zoo li qub siab -kub siab - siab (HPHT)-crushing route: ntxhib-grained ib zaug-pob zeb diamond particles synthesized ntawm HPHT yog siv los ua feedstock, uas tom qab ntawd raug rau crushing, purification, processes.
(1) Pob zeb diamond synthesis- Txoj kev HPHT feem ntau ua haujlwm ntawm qhov kub siab (1300-1700 degree) thiab siab siab (5-7 GPa), siv graphite hmoov thiab hlau catalyst hmoov ua cov khoom siv raw. Nyob rau hauv qhov kev txiav txim ntawm cov catalyst, cov pa roj carbon qhov chaw (graphite) hloov mus rau hauv pob zeb diamond.
(2) Crushing thiab shaping- Cov txheej txheem crushing thiab shaping ncaj qha cuam tshuam rau cov duab particle thiab cov txiaj ntsig ntawm qhov loj me ntawm lub hom phiaj. Feem ntau, txo qis cov khoom noj ntxhib rau micron lossis submicron qhov ntau thiab tsawg yog ua tiav los ntawm ob txoj hauv kev: kev cuam tshuam thiab dav hlau milling.
(3) Kev faib tawm- Kev faib tawm qhov loj me yog ib kauj ruam tseem ceeb hauv kev tsim cov pob zeb diamond micropowder, cuam tshuam rau kev tsim khoom thiab cov khoom zoo. Ntau cov tuam txhab lag luam tam sim no muab cov khoom siv ntuj tsim thiab cov centrifugation los tsim tag nrho -cov tshuaj micropowders los ntawm cov qib zoo mus rau qib ntxhib.
Thermal Application 1: Qhov zoo tshaj plaws Thermally Conductive Filler
Pob zeb diamond fillers yog dispersed nyob rau hauv polymer matrices (xws li, silicones, epoxy resins) los ua composites, uas sau microscopic khoob ntawm tshav kub- tsim cov khoom thiab cov dab dej kub, txo kev tiv thaiv thermal, thiab tsim kom muaj kev sib txuas hluav taws xob txuas ntxiv kom sai sai cov cua sov. Raws li cov khoom siv tseem ceeb hauv TIMs xws li thermal greases, pads, thiab encapsulants, pob zeb diamond hmoov ncaj qha txiav txim siab qhov ua tau zoo thiab ruaj khov ntawm kev tswj xyuas thermal.
Thermal Application 2: Siab -Performance Pob Zeb Diamond/Metal Composites
Leveraging pob zeb diamond lub siab thermal conductivity, qis coefficient ntawm thermal expansion, thiab tsawg ntom, cov kws tshawb fawb tau nquag tsim cov hlau-matrix composites ntxiv dag zog rau pob zeb diamond hais rau high-thermal-conductivity daim ntaub ntawv. Qhov zoo tshaj plaws thermophysical zog ntawm pob zeb diamond / hlau composites ua rau lawv zoo heev rau kev ntim khoom hluav taws xob. Kev tshawb fawb tam sim no feem ntau tsom rau kev tsim cov txheej txheem xws li hmoov metallurgy thiab kua infiltration. Conventionally tiav pob zeb diamond / aluminium composites ua tiav thermal conductivity ntawm 250-600 W / (m·K), thaum pob zeb diamond / tooj liab sib xyaw tuaj yeem ncav cuag 420-900 W / (m·K).
Pob zeb diamond hmoov yog cov khoom siv tseem ceeb uas txiav txim siab txog qhov txwv ntawm kev sib xyaw thermal conductivity; nws qhov zoo, qhov loj me, thiab siv lead ua morphology ncaj qha cuam tshuam rau cov khoom lag luam kawg. Ib yam li ntawd, kev sib raug zoo tsis zoo ntawm cov pob zeb diamond thiab hlau matrices- ua rau phonon tawg loj heev ntawm kev sib tshuam - txwv tsis pub muaj thermal conductivity. Qhov no tuaj yeem txo tau los ntawm kev ua kom zoo ntawm cov txheej txheem tsim, hloov kho qhov roughness thiab tshuaj lom neeg lub xeev ntawm pob zeb diamond hais los txhim kho kev sib txuas ntawm lub ntsej muag, los yog qhia txog kev hloov pauv ntawm cov txheej txheem ntawm matrix alloying lossis nto metallization ntawm pob zeb diamond hais.
Nrog lub hauv paus kev lag luam ruaj khov thiab kev lag luam loj heev, ntau lub lag luam hauv tsev tau nrawm R & D thiab kev lag luam ntawm pob zeb diamond-raws li cov khoom siv thermal tswj.