Nrog rau cov khoom tshwj xeeb xws li siab -kub tsis kam, plasma corrosion kuj, siab purity, thiab siab hluav taws xob rwb thaiv tsev, cov ceramics siab heev ua cov ntaub ntawv tseem ceeb rau cov khoom tseem ceeb hauv cov khoom siv semiconductor thoob plaws tag nrho cov txheej txheem ntws -xws li etching, nyias- zaj duab xis deposition, lithography, CMP, tu, thiab ntim. Cov khoom no cuam tshuam ncaj qha rau nti tawm los thiab cov khoom siv ruaj khov. Kab lus no, tsim nyob ib ncig ntawm cov txheej txheem tsim cov nti, tshuaj xyuas cov ntawv thov ntawm cov khoom siv ceramic hauv cov khoom siv hauv tsev, kev lag luam kev vam meej, thiab lub xeev tam sim no ntawm kev hloov pauv, txheej txheem los ntawm cov txheej txheem.
I. Wafer Manufacturing
Cov khoom tseem ceeb thiab cov ntaub ntawv: ceramic tais, ceramic heaters, semiconductor li qub, lub tshuab nqus tsev qhov chaw (Al₂O₃, Si₃N₄, SiC, thiab lwm yam)
Cov kev ua tau zoo tseem ceeb: siab purity, siab -kub tsis kam, thermal shock resistance, siab flatness - los txhawb substrate npaj rau silicon wafers.
II. Thermal processing (Oxidation / Diffusion / Annealing)
Cov khoom tseem ceeb thiab cov ntaub ntawv: SiC nkoj, rauv tube ceramic qhov chaw, ceramic rhaub, ceramic nozzles, ceramic li qub
Kev ua haujlwm tseem ceeb: siab-kub tsis kam (Ntau dua lossis sib npaug li 1200 degree), thermal shock resistance, low outgassing, siab purity - haum rau siab -kub oxidation/diffusion/annealing processes.
III. Nyias- Zaj duab xis tso tawm
Cheebtsam thiab cov ntaub ntawv tseem ceeb: ceramic heaters (AlN, Al₂O₃, Si₃N₄); Cov nplhaib tso nyiaj, chamber liners, cov khoom faib roj (SiC, Al₂O₃)
Qhov tseem ceeb ntawm kev ua tau zoo: siab- qhov kub thiab txias tsis sib xws hauv ± 1 degree, thermal stability zoo, tsis tshua muaj hluav taws xob, tsis kam mus rau siab - kub deformation - haum rau ntev - ncua sij hawm deposition.
IV. Lithography thiab Txheej / Kev Tsim Kho
Cov khoom tseem ceeb thiab cov ntaub ntawv: cov theem precision, ceramic nqus chucks, lub npog ntsej muag, kev co -damping bases (cordierite, SiC, qis-expansion iav-ceramics xws li Zerodur); rau lub tsho tiv no / tsim cov khoom siv: ceramic caj npab, microporous ceramic chucks, nqus cov ntiv tes
Kev ua haujlwm tseem ceeb: ultra-coefficient qis ntawm thermal expansion, nano-theem ultra-siab flatness, siab rigidity, vibration damping - kom ntseeg tau siab -precision raug nyob rau hauv lithography; txheej / txhim kho qhov chaw kuj yuav tsum muaj tshuaj tiv thaiv corrosion thiab tsis tshua muaj particle tiam.
V. Kev
Cov khoom tseem ceeb thiab cov khoom siv: electrostatic chucks (Al₂O₃, AlN); tsom rings, da dej taub hau, roj faib daim hlau, chamber liners (SiC, Y₂O₃ li cov khoom siv txheej)
Cov kev ua haujlwm tseem ceeb: plasma corrosion kuj, ultra-siab purity, tsis muaj particle shedding, siab hluav taws xob rwb thaiv tsev - haum rau siab - zaus, siab - siv etching.
VI. Ion implantation
Cov khoom tseem ceeb thiab cov ntaub ntawv: ceramic ntsia hlau li qub, insulating ceramic structural qhov chaw, siab -kub corrosion- resistant ceramic Cheebtsam
Cov kev ua haujlwm tseem ceeb: siab purity, siab -voltage resistance, low outgassing, dimensional stability - haum rau ion beam thauj thiab kev sib cais.
VII. CMP (Chemical Mechanical Planarization)
Cov khoom tseem ceeb thiab cov khoom siv: ceramic chucks, ceramic worktables, porous ceramic phaj
Cov kev ua tau zoo tseem ceeb: siab flatness, siab rigidity, hnav tsis kam, tshuaj corrosion kuj - los txhawb wafer planarization.
VIII. Ntxuav
Cov khoom tseem ceeb thiab cov ntaub ntawv: ceramic nozzles, ceramic li qub, corrosion-resistant ceramic yam ntxwv qhov chaw
Cov kev ua haujlwm tseem ceeb: tiv thaiv kom muaj zog acids / alkalis, siab purity, tsis muaj particle tso tawm - haum rau qhov chaw ntub dej.