Nyob rau hauv lub etching chambers ntawm semiconductor manufacturing, plasma bombards chamber phab ntsa thiab cov khoom nyob rau hauv ceev ntawm ob peb kilometers -los yog txawm kaum tawm txhiab meters-ib ob. Cov khoom xws li lub taub hau da dej, chamber liners, thiab wafer susceptors yuav tsum tsis tsuas yog tiv thaiv cov tshuaj tua kab mob ntawm cov roj corrosive heev, tab sis kuj tseem muaj kev huv huv thiab qhov ruaj khov nyob rau hauv qhov hnyav thermal shock thiab hluav taws xob thaj chaw ib puag ncig. Yog tias txawm tias ib qho kev sib cais los yog ib qho kab ntawm impurities raug tso tawm, tag nrho cov wafer yuav raug muab pov tseg. Nyob rau hauv cov xwm txheej zoo li no, siab -purity silicon carbide ceramics (purity Ntau dua lossis sib npaug li 99.5%, nrog rau cov khoom siv hluav taws xob- qib nce mus txog 99.99%)-muaj hardness mus txog ntawm pob zeb diamond, zoo heev thermal conductivity, tshuaj lom neeg inertness, nyob ze -, tsis muaj kev qhib siab, thiab tsis muaj kev qhib siab. cov khoom siv tsis sib xws "skeletal" rau cov khoom siv semiconductor.
Tam sim no, SiC cov khoom siv rau cov ntawv thov semiconductor feem ntau yog tsim los ntawm ob txoj hauv kev. Thawj yog cov hmoov sintering txoj kev (SSiC/HPSiC), uas densifies siab - purity hmoov ntawm qhov kub thiab txias. Txoj hauv kev no tuaj yeem ua kom haum cov duab nyuaj thaum tswj hwm tus nqi ua haujlwm, ua rau nws yog cov khoom siv tseem ceeb rau siab - qhov kub thiab txias, ntxuav qhov chaw xws li wafer nkoj, susceptors, thiab caj npab robotic. Qhov thib ob yog cov tshuaj vapor deposition (CVD-SiC) txoj kev, uas loj hlob cov khoom atom txheej los ntawm atom txheej los ntawm gaseous precursors. Cov khoom ua tau tuaj yeem ua tiav cov purities siab li 99.9995%, tsis muaj cov ciam teb, ultra-siab ceev, thiab muaj zog tiv thaiv cov ntshav plasma bombardment- sawv cev rau qhov kawg daws rau cov ntshav plasma corrosion kuj. Cov khoom siv tseem ceeb xws li cov taub hau ceramic feem ntau yog tsim los ntawm cov txheej txheem no, thiab lawv qhov zoo cuam tshuam ncaj qha rau wafer etching uniformity thiab tag nrho cov txiaj ntsig.
Txawm li cas los xij, cov txheej txheem txheej txheem rau CVD-SiC da dej yog qhov siab heev. Txhua kauj ruam -los ntawm kev npaj ntawm semiconductor- qib hmoov raw cov ntaub ntawv nrog purity Ntau dua los yog sib npaug rau 99.99%, kom densification sintering mus rau ze - theoretical ntom thiab tsis qhib porosity, mus rau lub meej atom-los ntawm -atom kev loj hlob ntawm CV, CV thiab precision machining- yog qhov tob hauv thaj tsam ntawm kev ua haujlwm siab heev. Tau ntev, kev ua lag luam rau cov khoom siv no tau ruaj khov los ntawm cov lag luam txawv teb chaws. Txawm li cas los xij, raws li cov txheej txheem tsim khoom hauv tsev semiconductor txuas ntxiv mus rau ntau qhov tseem ceeb, qhov kev thov rau kev tsim khoom hauv cheeb tsam ntawm cov khoom siv tau dhau los ua ceev ceev. Lub peev xwm rau loj - nplai fabrication thiab siab - precision machining ntawm cov khoom no tau dhau los ua ib qho ntawm cov kev taw qhia tseem ceeb uas tau ua raws li tag nrho cov kev lag luam semiconductor, los ntawm cov chaw muag khoom sab saud mus rau cov chaw tsim khoom qis.