Tam sim no, lub ntiaj teb no semiconductor thiab siab -kawg kho qhov muag kev lag luam tau nkag mus rau hauv ib lub sij hawm ntawm iteration sai thiab precision breakthroughs. Kev nce qib tsis tu ncua ntawm cov txheej txheem qib siab thiab kev txhim kho txuas ntxiv ntawm qib siab - kawg cov cuab yeej yog tsav cov khoom tseem ceeb mus rau qhov kev taw qhia huab ntawm miniaturization, ultra-siab precision, ultra- kev sib koom ua ke siab, thiab kev ruaj ntseg siab. Txawm hais tias nws yog cov khoom siv hluav taws xob zoo tshaj plaws, siab -kawg lithography tshuab kho qhov muag, lossis loj- nplai gratings, precision fused silica, daim npog qhov ncauj substrates, thiab lwm yam khoom siv kho qhov muag, tsis tau muaj qhov xav tau nruj heev yog ua rau saum npoo flatness, smoothness, thiab defect-dawb zoo. Machining raug tau mus txog nanometer lossis txawm tias sub{10}}nanometer theem.
Tawm tsam qhov keeb kwm yav dhau los no, Tshuaj Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Txhuam Polishing Kev ua tau zoo qab nthab ntawm cov txheej txheem CMP tseem ceeb yog nyob ntawm cov khoom zoo ntawm cov ntaub ntawv polishing. High- zoo polishing abrasives thiab tshuab yog lub hauv paus rau kev ua tiav ultra- precision machining, tsis tshua muaj kev puas tsuaj, thiab kev ua haujlwm siab.
Ntawm ntau lub tshuab polishing abrasive, qhov chaw ua haujlwm saum npoo ntawm ceria abrasives tuaj yeem cuam tshuam nrog silicon- cov ntaub ntawv raws li, tsim cov tshuaj tiv thaiv softer txheej uas tom qab tshem tawm los ntawm kev sib txhuam. Qhov no mechanism yields ib tug smoother nto thaum tuav ib tug siab tshem tawm tus nqi. Kev tshawb fawb tau pom tias doping hloov kho ntawm ceria tuaj yeem txuas ntxiv nws txoj haujlwm polishing, zoo dua cov yam ntxwv ntawm cov khoom ua haujlwm thiab txhim kho polishing precision, ua rau nws tsim nyog rau ultra-precision processing xav tau ntawm semiconductors. Yog li ntawd, txoj kev loj hlob ntawm ceria-raws li cov khoom siv polishing tshuab tau dhau los ua kev tshawb fawb tseem ceeb thiab cov kev taw qhia tseem ceeb hauv CMP tam sim no.
Txawm li cas los xij, kev siv cov khoom siv hauv tsev uas tsim los ntawm ceria composite abrasive systems tseem raug txwv los ntawm ntau yam teeb meem engineering, xws li kev nplua tsis txaus -tuning tswj, yooj yim agglomeration ntawm nano-abrasives, tsis zoo dispersion stability, thiab tsis txaus siab batch - rau - batch stability. Tsis tas li ntawd, kev tsim qauv tsim kho rau cov khoom siv sib txawv (piv txwv li, silicon wafers, lithography Cheebtsam, fused silica, quartz qhov ncauj qhov ntswg, thiab lwm yam) kuj muaj qee yam kev cov nyom. Yuav ua li cas tswj cov morphology thiab dispersibility ntawm nano -ceria, optimize polishing kev ua tau zoo los ntawm kev hloov kho thiab cov tswv yim sib xyaw, thiab tsim kom zoo polishing tshuab haum rau siab - daim ntawv thov kawg tau dhau los ua ib qho teeb meem tseem ceeb uas tag nrho kev lag luam tsom mus rau thiab yuav tsum tau daws sai.