Nrog rau kev siv dav dav ntawm siab- lub zog lasers hauv thaj chaw xws li kev lag luam precision machining, 5G / 6G kev sib txuas lus, kev tsav tsheb, thiab tshuaj laser, kev tswj xyuas thermal tau dhau los ua qhov tseem ceeb hauv kev txwv tsis pub kev txhim kho kev ua haujlwm. Cov cua kub tsis zoo tuaj yeem ua rau kev ua haujlwm kho qhov muag tsis zoo xws li emission wavelength hloov thiab luv fluorescence lub neej nyob rau hauv cov mob me me, lossis ua rau cov cuab yeej laus thiab cuam tshuam rau cov khoom siv ruaj khov thiab kev ntseeg siab ntawm cov cuab yeej hauv cov mob hnyav. Kev sib ntsib tsis tu ncua ua kom muaj cua sov ntau dua, cov hlau tsoos thiab cov khoom siv hluav taws xob ceramic tau ua pov thawj tsis txaus. Yog li ntawd, qhov thib peb - tiam semiconductor khoom, Silicon Carbide (SiC), yog sai dhau los ua "lub hnub qub khoom" nyob rau hauv lub siab - lub zog laser cua sov dab dej, leveraging nws zoo zoo xws li thermal conductivity, tsis tshua muaj thermal expansion coefficient, thiab zoo heev stability.
Dab tsi yog Qhov Zoo ntawm SiC Heat Sinks?
Thawj txoj kev ua kom txias rau siab - lub zog semiconductor laser ntim muaj xws li ntuj convection heat sink cooling, microchannel cooling, thermoelectric cooling, thiab spraying cooling. Ntawm cov no, ntuj convection cua sov dab dej txias yog qhov kev lag luam tshaj plaws thiab kev ua kom txias rau ib leeg -emitter semiconductor lasers vim nws yooj yim ntawm fabrication thiab sib dhos. Feem ntau, kom txo tau qhov kub thiab txias ntawm laser nti, cov ntaub ntawv uas muaj thermal conductivity yog siv los ua cov dab dej kub kom nce qhov chaw ntawm lub ntuj convection, yog li txhim kho cov cua sov. Thaum hlau kub dab dej xws li tooj liab thiab txhuas muab cov nqi zoo, lawv cov coefficients ntawm thermal expansion (CTE) tsis zoo nrog kev nce xov xwm xws li GaN thiab InP. Qhov kev tsis sib haum no tuaj yeem ua rau muaj kev ntxhov siab thermal thaum lub caij kub, ua rau lub laser ua haujlwm tau zoo lossis ua rau lub laser nti tawg thiab ua tsis tiav. Aluminium Nitride (AlN) ceramic heat sinks ntsib teeb meem hauv kev tswj cov kev sib tshuam ntawm cov thermal tiv thaiv thiab tswj cov qauv kev ruaj ntseg, ua rau nws nyuaj rau ua tau raws li qhov xav tau nruj ntawm kilowatt - qib thiab siab zog laser tshuab. Txawm hais tias CVD pob zeb diamond pom zoo thermal conductivity, nws cov nqi npaj yog txwv tsis pub siab. Hauv qhov sib piv, Silicon Carbide (SiC) cov dab dej kub ua kom pom cov txiaj ntsig zoo nrog tus nqi siab -kev ua tau zoo:
High Thermal Conductivity: SiC boasts ib chav -kub thermal conductivity txog li 490 W/(m·K). Txawm hais tias qis dua li ntawm CVD pob zeb diamond, qhov loj hlob ntawm cov khoom siv thev naus laus zis rau 6-nti SiC wafers ua rau cov nqi tsev uas tsuas yog 1/20 txog 1/15 ntawm CVD pob zeb diamond.
Tsawg Thermal Expansion Coefficient: SiC muaj qhov qis CTE ntawm 4.0 × 10⁻⁶ / K, uas zoo sib xws nrog cov ntsiab lus laser nce qib xws li GaN thiab InP, ua kom muaj txiaj ntsig zoo rau kev tsim cov thermal stress.
Kev ruaj ntseg zoo: SiC nthuav tawm cov oxidation tsis kam thiab hluav taws xob tiv thaiv, nrog Mohs hardness ntawm 9.2. Nws tuaj yeem ua kom lub sijhawm ntev - lub sijhawm ua haujlwm ruaj khov ntawm cov tshuab laser txawm tias nyob rau hauv cov xwm txheej hnyav xws li kub siab thiab muaj zog hluav taws xob.
Kev npaj ntawm SiC Heat Sinks
SiC yog ib qho tsis yog -centrosymmetric compound raws li covalent bonds. Nws cov qauv yooj yim muaj xws li staggered kev npaj ntawm plaub silicon atoms thiab ib tug carbon atom, tsim ib tug tetrahedral qauv los ntawm SP³ hybridized covalent bonds. Feem ntau SiC polytypes suav nrog 3C-SiC, 4H-SiC, thiab 6H-SiC. Qhov sib txawv ntawm kev npaj thiab kev ua tau zoo ntawm cov polytypes no muab lub hauv paus rau scenario-kev hloov pauv tshwj xeeb ntawm cov dab dej kub.
Chemical Vapor Deposition (CVD): Txoj kev no tuaj yeem tsim tau siab -purity 4H-SiC thiab 6H-SiC nrog thermal conductivities xws li 350-500 W/(m·K). Thaum lub thermal conductivity siab nyob rau hauv tshav kub extraction, seem stability kom cov khoom nws tus kheej tsis deform tom qab tshav kub rho tawm. Kev sib xyaw ua ke ntawm ob qho tib si yog qhov tseem ceeb rau kev ua kom lub sijhawm ntev - lub sijhawm ua haujlwm ruaj khov ntawm cov khoom siv hluav taws xob laser siab raws li qhov xav tau. Leveraging ob qhov zoo ntawm high thermal conductivity thiab seem stability, SiC npaj los ntawm CVD technology los ua cov kev daws teeb meem ntsuas kev ua tau zoo thiab kev ntseeg tau.
Lub cev Vapor Transport (PVT): Cov txheej txheem no muaj qhov kub siab tshaj 2000 degree, ua rau 4H-SiC thiab 6H-SiC nrog thermal conductivity ntawm 300-490 W/(m·K). Nws muaj ob qho tib si thermal conductivity thiab mechanical zog, ua rau nws haum rau high-power laser pab kiag li lawm nrog nruj structural stability yuav tsum tau.
Liquid Phase Epitaxy (LPE): Txoj kev no siv qhov ntsuas kub nruab nrab ntawm 1450-1700℃ntau yam, tso cai rau kev tswj xyuas meej ntawm kev tsim ntawm 3C-SiC thiab 4H-SiC polytypes, ua tiav thermal conductivities ntawm 320-450K W / (m). Nws qhov zoo yog qhov tseem ceeb hauv high-end laser li xav tau lub zog siab, kev ruaj ntseg siab, thiab lub neej ntev, qhov sib xws ntawm polytype yog qhov tseem ceeb.
Daim ntawv thov
Ib leeg Crystal SiC Heat Sinks:
SiC ib leeg siv lead ua cua sov feem ntau yog tsim los ntawm kev loj hlob SiC ib leeg siv lead ua ingots siv cov kev hloov kho Lely, ua raws li kev txiav, sib tsoo, thiab polishing. Lawv qhov theoretical thermal conductivity tuaj yeem ncav cuag 490 W / (m·K), tshaj li ntawm Cu heat sinks, 1.5 npaug ntawm AlN cov dab dej kub, thiab deb tshaj Si cov dab dej kub. Qhov no ua rau lawv cov khoom siv hluav taws xob zoo tshaj plaws hauv cov ntawv ntim khoom siab heev uas yuav tsum tau ua kom siab siab -kawg kub dissipation. Leveraging lub siab thermal conductivity ntawm ib leeg -crystal SiC, Hu Sheng'an li al. tsim ib qho -crystal SiC cov dab dej kub thiab ib qho -Crystal SiC tooj liab-clad heat sinks. Lawv tau ua cov ntawv ntim khoom ntawm 640nm liab laser chips thiab siab - zog 915nm laser chips, feem. Piv rau AlN cov dab dej kub, 640nm liab laser ntim nrog ib zaug -crystal SiC lub dab dej kub tau pom qhov txo qis ntawm 0.25A hauv qhov pib tam sim no, 0.5W nce siab tshaj plaws tso zis hluav taws xob, thiab electro{20}}kev hloov kho qhov muag ntawm 42.7%. Lub 915nm semiconductor laser ntim nrog ib zaug -crystal SiC tooj liab-clad heat sink nthuav tawm 0.26A txo qhov pib tam sim no, 1.9W nce siab tshaj plaws tso zis hluav taws xob, thiab electro{28}}kho qhov muag conversion efficiency ntawm 64.9%. Ib leeg-Crystal SiC cov dab dej kub ua kom muaj txiaj ntsig zoo rau cov cua kub dissipation thiab kev ua haujlwm ntawm semiconductor lasers.
SiC Ceramic Microchannel Kub Sinks:
Rau siab- nruab nrab- lub zog lasers xav tau cov kua txias, cov kev daws teeb meem tseem ceeb suav nrog microchannel cua sov dab dej, macro- channel dej txias, thiab thermoelectric txias. Thaum macro-channel dej txias tshuab muaj cov qauv yooj yim, lawv raug kev txom nyem los ntawm kev ua kom txias txias, feem ntau ua rau cov dej txias tsis tiav nyob ze ntawm qhov chaw tshav kub thiab qhov chaw ntws nrawm nrawm, uas ua rau qhov kub tsis zoo. Thermoelectric txias tuaj yeem tswj qhov kub ntawm qhov nce nruab nrab, tab sis nws qhov kev ua tau zoo poob qis heev nyob rau hauv siab - kub thiab ntsib cov nqi txwv. Microchannel conduction txias tshuab, uas zoo heev nthuav cov tshav kub dissipation cheeb tsam los ntawm microscale channel tsim, zoo txhim khu kev ua hauj lwm ntawm lub dab dej kub thiab qhov kub thiab txias teb uniformity, ua ib tug kev tshawb fawb tsom nyob rau hauv thermal tswj rau siab - nruab nrab - fais fab lasers. Vim lub siab hardness thiab brittleness ntawm SiC ceramics, fabricating complex internal flow channels siv tsoos CNC machining yog qhov nyuaj heev. Qhov tshwm sim ntawm 3D luam ntawv thev naus laus zis, xws li Digital Light Processing (DLP), tau daws qhov teeb meem no tau zoo. Cov kws tshawb fawb tam sim no tuaj yeem luam tawm ncaj qha SiC ceramic microchannels nrog txoj hauv kev staggered tus pin{14}}fin qauv (MCHS-SF). Cov pin fins mob siab rau cov cua txias, cuam tshuam cov txheej txheem thermal ciam teb thiab ua kom cov cua sov hloov pauv.
Composite Heat Sink Structures:
Qhov no suav nrog kev siv 4H-SiC raws li lub substrate, epitaxially loj hlob ib tug heev thermally conductive polycrystalline pob zeb diamond txheej (thermal conductivity> 1780 W·m⁻¹·K⁻¹) ntawm nws nraub qaum, thiab fabricating AlGaN-GaN heterostructure nyob rau sab pem hauv ntej. Lub interface tsim ntawm pob zeb diamond thiab SiC los ntawm atomic-theem intimate bonding exhibits high bonding zog, ib tug ntom qauv, thiab ob peb yam tsis xws luag. Cov cuab yeej siv cov txheej txheem sib xyaw no tau pom qhov siab tshaj plaws ntawm qhov kub ntawm 52.5℃qis dua ib txwm siv SiC substrate qauv, 41% txo qis hauv thermal resistance, thiab 19% nce siab tshaj plaws ntws tam sim no. Qhov tseem ceeb tshaj plaws, qhov txo qis hauv kev ua haujlwm kub tau txuas ntxiv lub cuab yeej Lub Sijhawm Ua Tsis Txaus Siab (MTTF) los ntawm ntau dua 100 zaug, ua tiav ob qho kev ua kom zoo dua ntawm kev ua kom sov dissipation efficiency thiab cov txheej txheem sib haum.
