Khoom Description

Lub semiconductor ceramic substrate yog ib qho tseem ceeb hauv hluav taws xob tivthaiv uas sib xyaw cov khoom siv ceramic nrog cov txheej txheem metallization. Nws feem ntau yog siv rau kev nqa, kev sib txuas, dissipating tshav kub los ntawm, thiab tiv thaiv semiconductor chips (xws li kev sib xyaw ua ke, cov khoom siv hluav taws xob, laser diodes, thiab lwm yam). Nws ua haujlwm ua tus choj txuas lub ntiaj teb microscopic hauv lub nti mus rau macroscopic sab nraud circuit. Hauv kev lag luam xws li hluav taws xob hluav taws xob, RF / microwave, lasers, thiab automotive electronics, ceramic substrates yog qhov tseem ceeb vim lawv cov khoom zoo heev.

Khoom npe	Alumina Ceramic Substrate
Khoom siv	Alumina / Al2O3
Xim	Customized raws li tus neeg yuav tsum tau ua
qhov loj	Customized raws li tus neeg yuav tsum tau ua
Machining raug	Ra: 0.02
Ntim	Carton / Pallet / Ntoo rooj plaub (Raws li tus neeg yuav tsum tau muaj)
Lub sij hawm xa tuaj	Cov khoom lag luam txheem-Hauv 3 hnub
Yam khoom tsim	Raws li tus neeg siv khoom kos duab lossis qauv
Nta	Zoo zoo, tus nqi qis, Ntau lub Hoobkas, xa tuaj rau koj raws li qhov ze tshaj plaws rau koj qhov chaw
Daim ntawv thov	Muaj Ceramics
Daim ntawv pov thawj	ISO, CE

Semiconductor Ceramic Substrate

Production Process

Production Process 2

Ceramic kev ua tau zoo parameter

Tus lej	Kev ua tau zoo	Chav tsev
			997 ua por	999 porcelain ua
			Al2O3	Al2O3
1	Qhov ntom	g/cm3	3.92	3.98
2	Flexural zog	MPa	400	550-600
3	Fracture toughness	MPa·m 1/2	5.6-6	2.8-4.5
4	Dielectric tsis tu ncua	εr (20 degree, 1MHz)	9.8	9.9
5	Hardness	GPa	16.3	16.3-18
	Hardness	HRC	81	81-83
6	Volume resistivity	Ω·cm (20 degree)	10 14	10 14
7	Elastic modulus	GPa	380	400
8	Coefficient ntawm thermal expansion	×10-6/k	5.4-8.4	6.4-8.9
9	Compressive zog	MPa	2300	2300
10	Kev puas tsuaj	g / cm2	0.1	0.1
11	Thermal conductivity	W / m × k (20 degree)	35	38.9
12	Poisson tus ratio	/	0.22	0.22
13	Rwb thaiv tsev zog	kv/mm	30	30
14	Kub	degree	1700	1700
15	Roughness	R	0.02	0.02

Cov yam ntxwv tseem ceeb ntawm kev ua haujlwm

Zoo heev thermal conductivity:Qhov no yog ib qho ntawm cov khoom tseem ceeb ntawm ceramic substrates. Feem ntau siv ceramics xws li txhuas nitride (AlN) thiab beryllium oxide (BeO) muaj cov thermal conductivity deb tshaj li cov qauv PCB (xws li FR-4), ua kom sai sai ntawm cov cua sov tsim tawm thaum lub sijhawm ua haujlwm nti thiab tiv thaiv thermal tsis ua haujlwm.
Zoo hluav taws xob rwb thaiv tsev:Ceramic cov ntaub ntawv yog inherently zoo hluav taws xob insulators, muab siab dielectric zog thiab ntim resistivity. Qhov no ua tau raws li qhov yuav tsum tau muaj rau kev sib cais hluav taws xob hauv high-voltage thiab siab- daim ntawv thov fais fab.
Matched Coefficient of Thermal Expansion (CTE) nrog Chips:CTE ntawm ceramics (tshwj xeeb tshaj yog AlN thiab Si₃N₄) yog ze rau cov khoom siv semiconductor nti xws li silicon (Si) thiab gallium arsenide (GaAs). Qhov kev sib txuam no txo cov kev ntxhov siab thermal los ntawm qhov kub thiab txias, txhim kho kev ntseeg tau thiab kev ua neej nyob ntawm cov qauv ntim khoom.
High Mechanical Strength thiab Stability:Ceramic cov ntaub ntawv yog ib qho nyuaj thiab nruj, muab kev txhawb zog txhua yam rau cov chips tsis yooj yim. Lawv kuj muaj kev tiv thaiv zoo heev rau qhov kub thiab txias, corrosion, thiab hluav taws xob, ua kom muaj kev ruaj ntseg hauv qhov chaw hnyav.
High Surface Flatness thiab Tsawg Roughness:Qhov saum npoo ntawm ceramic substrates tuaj yeem ua tiav qhov tshwj xeeb flatness los ntawm precision polishing. Qhov no yog qhov tseem ceeb rau cov khoom siv uas yuav tsum tau muaj kev sib raug zoo (piv txwv li, eutectic soldering) thiab kho qhov muag (xws li lasers).
Ua kom muaj siab -Density Interconnection:Los ntawm nyias- zaj duab xis los yog tuab - zaj duab xis metallization (xws li, depositing tooj liab, kub, nyiaj) rau ntawm tej hub nto, siab - precision Circuit Court qauv yuav etched. Qhov no ua kom yooj yim -qhov ceev, qis-kab mob hluav taws xob sib txuas ntawm cov nti thiab lub ntiaj teb sab nraud.

Daim ntawv thov khoom

Leveraging lawv cov khoom zoo, semiconductor ceramic substrates tau dav siv nyob rau hauv cov teb nrog cov kev xav tau nruj rau cov cua sov dissipation, kev ntseeg tau, thiab siab - zaus ua haujlwm:

Fais fab Electronic Modules:Siv dav hauv ntim khoom siv hluav taws xob xws li Insulated Gate Bipolar Transistors (IGBTs), lub zog MOSFETs, thiab thyristors. Hauv kev tsim hluav taws xob tshiab (photovoltaics, cua), hluav taws xob tsheb fais fab thiab cov khoom siv hluav taws xob, cov khoom siv zaus hloov pauv, thiab cov phiajcim ntse, cov khoom siv hluav taws xob (tshwj xeeb tshaj yog AlN thiab Si₃N₄) yog cov khoom tseem ceeb uas ua kom muaj cua sov zoo thiab siab - hluav taws xob rwb thaiv tsev.
Hybrid Integrated Circuits (HICs) thiab Multi-Chip Modules (MCMs):Siv nyob rau hauv siab -kev ntseeg siab HICs thiab MCMs rau tub rog, aerospace, thiab kev sib txuas lus daim ntawv thov, muab zoo heev interconnection substrates, tshav kub dissipation paths, thiab hermetic ntim bases.
RF thiab Microwave Devices:Hauv cov chaw nres tsheb hauv paus, radar, thiab kev sib txuas lus satellite, ceramic substrates (tshwj xeeb yog qis- poob Al₂O₃ lossis AlN) yog siv los ntim cov khoom siv RF xws li lub zog amplifiers, qis- suab nrov amplifiers, thiab cov ntxaij lim dej, muab cov yam ntxwv ruaj khov siab - zaus.
Laser thiab Optoelectronic Devices:Ua hauj lwm raws li cov dab dej kub thiab cov cab kuj rau siab -lub zog laser diodes (LDs), lub teeb -emitting diodes (LEDs), photodetectors, thiab lwm yam. Lawv cov thermal conductivity zoo tswj cov cua kub uas tsim los ntawm lasers, kom ruaj khov tso zis zog thiab wavelength.
Automotive Electronics thiab Aerospace:Siv nyob rau hauv lub cav tswj units (ECUs), sensors, thiab lub hwj chim tswj systems, raws li tau zoo raws li yuav tsum tau rau siab vibration, loj kub variations, thiab muaj kev ntseeg siab.
Sensor thiab MEMS Ntim:Siv rau siab - kub, corrosion- tiv taus siab sensors, accelerometers, thiab lwm yam., muab kev tiv thaiv zoo thiab hluav taws xob cuam tshuam.