Khoom Description
Aluminium nitride ceramic substrates yog cov khoom siv ceramic zoo heev nrog aluminium nitride ua thawj theem crystalline. Vim lawv cov thermal conductivity tshwj xeeb, rwb thaiv tsev zoo heev, thermal expansion coefficient txuam nrog silicon, thiab cov neeg kho tshuab zoo heev, lawv tau dhau los ua cov khoom tseem ceeb hauv cov khoom siv hluav taws xob niaj hnub no, tshwj xeeb tshaj yog rau siab - zog, siab - ntom ntom integrated circuits. Lawv raug qhuas tias yog "cov khoom siv zoo tshaj" rau tom ntej - tiam hluav taws xob substrates thiab ntim khoom.
Nws lub hom phiaj tsim qauv yog los daws cov teeb meem thermal uas tshwm sim los ntawm cov khoom siv hluav taws xob, tshwj xeeb tshaj yog cov khoom siv hluav taws xob (yog tias IGBTs, LEDs, thiab laser diodes koom nrog) thaum ua haujlwm. Nws ua kom ntseeg tau tias cov khoom siv no ua haujlwm zoo thiab ruaj khov ntawm qhov ntsuas kub zoo, yog li txhim kho kev ua tau zoo, kev cia siab, thiab lub neej ntev.
Khoom ua haujlwm
- High Thermal Conductivity: Qhov no yog nws qhov txiaj ntsig zoo tshaj plaws. Theoretical thermal conductivity tuaj yeem ncav cuag 320 W / (m·K). Kev lag luam muaj polished substrates feem ntau ua tiav thermal conductivity nyob rau hauv thaj tsam ntawm 170-230 W / (m·K), ntau dua li ntawm alumina ceramic (kwv yees . 20-30 W / (·K)) thiab mus txog qhov kev ua tau zoo ntawm beryllia ceramic tab sis tsis muaj tshuaj lom, ua rau nws yog ib qho zoo heev thermal tswj cov khoom.
- Thermal Expansion Coefficient Matched to Silicon: Nws coefficient ntawm thermal expansion (CTE, approx. 4.5 × 10⁻⁶/K) yog ze heev rau ntawm silicon chips (kwv yees . 3.5-4.0 × 10⁻⁶/K).
- Hluav taws xob rwb thaiv tsev zoo heev: Nws muaj lub zog ntim siab thiab lub zog dielectric, ua haujlwm zoo li hluav taws xob rwb thaiv tsev uas ua tau raws li cov kev xav tau ntawm kev sib cais hluav taws xob ntawm siab -voltage thiab siab- cov khoom siv hluav taws xob.
- Zoo Mechanical Strength thiab Hardness: Nws muaj cov neeg kho tshuab siab zog, zoo hardness, thiab zoo hnav tsis kam, muab kev txhawb zog thiab kev tiv thaiv rau chips thiab circuits.
- Tsawg Dielectric Constant thiab Poob: Nws muaj qhov tsis tshua muaj dielectric tsis tu ncua (kwv yees . 8-9) thiab tsis tshua muaj dielectric poob, uas muaj txiaj ntsig zoo rau siab -frequency signal kis, txo cov teeb liab qeeb thiab poob.
- Kev ruaj ntseg zoo tshuaj: Nws tiv taus qhov kub thiab txias, corrosion, thiab tsis hnov mob nrog feem ntau cov hlau molten (xws li txhuas, tooj liab), tso cai rau kev ua haujlwm siab.
- Polished Surface yam ntxwv: Tom qab precision polishing, qhov roughness ntawm qhov (Ra) tuaj yeem ncav cuag qib nanometer (feem ntau<0.01 µm), resulting in a mirror-like finish.
Daim ntawv thov khoom
- High-Power LED Ntim: Siv los ua cov khoom thauj khoom substrate rau COB (Chip on Board) lossis siab - lub zog LED chips, sai sai dissipating cov cua sov uas tsim los ntawm cov chips kom ntseeg tau tias LED luminous efficiency, xim kub stability, thiab kev pab lub neej.
- Fais fab Semiconductor Modules: Siv nyob rau hauv ntim substrates (cov ceramic ib feem ntawm DBC los yog AMB substrates) los yog rau ncaj nti txuas rau tom ntej no - tiam fais fab li xws li IGBTs, SiC (silicon carbide), thiab GaN (gallium nitride), tswj cov cua kub ntau uas generated los ntawm lub zog ceev ceev.
- Microwave RF thiab Laser Devices: Siv nyob rau hauv ntim ntawm RF fais fab amplifiers, microwave Cheebtsam, laser diodes (LDs), thiab lwm yam., qhov uas nws tsis tshua muaj dielectric poob thiab siab thermal conductivity tseem ceeb heev.
- Integrated Circuit Packaging: Ua hauj lwm raws li cov cab kuj substrate los yog cua kub dab dej nyob rau hauv siab -reliability Multi-Chip Modules (MCMs) thiab System-nyob rau hauv -Package (SiP) rau aerospace, tub rog, thiab automotive electronics.
- Thermoelectric Cooler (TEC) Substrates: Ua raws li cov rwb thaiv tsev kub dissipation substrate rau thermoelectric txias chips.
- Sensor Ntim: Siv rau kev tiv thaiv thiab cua kub dissipation ntawm sensors nyob rau hauv siab - kub, heev corrosive ib puag ncig.
- Kev tshawb fawb thiab kev loj hlob: Feem ntau siv nyob rau hauv lub chaw soj nstuam raws li ib tug zoo tagnrho substrate khoom rau siab - zoo nyias- zaj duab xis deposition.
Daim ntawv pov thawj thiab Honors
Peb pab pawg kws tshaj lij muaj 20 xyoo ntawm R&D kev paub hauv nws tus kheej tsim thiab tsim cov khoom siv ceramics thiab precision ceramics, ua tiav lub ntiaj teb- cov qauv thiab qib. Peb tshwj xeeb hauv kev ua kom zoo thiab txhim kho cov khoom lossis cov qauv tsim, kev ua tau zoo, thiab kev tsim cov txheej txheem los ntawm kev tshawb fawb thiab cov tswv yim tsim nyog rau cov neeg siv khoom thaum lub sijhawm tsim thiab tsim khoom. Peb tau cog lus rau kev ua haujlwm thev naus laus zis, txhim kho cov khoom zoo, thiab txo cov nqi tsim khoom.
Kev Tswj Xyuas Zoo
Peb nruj me ntsis ua raws li ISO 9001 kev tswj xyuas zoo kom ntseeg tau tias muaj kev sib xws:
- 100% raw khoom soj ntsuam
- Advanced kub- nias cov kab ntau lawm
- Hauv -kev sim hauv tsev: qhov ntom ntom, hardness, microstructure tsom xam
- Thib peb -cov ntawv pov thawj (SGS, CE, ROHS muaj raws li qhov kev thov)
Hoobkas zog
Peb cov kev cob qhia digital, cov chaw tsim khoom ntse, thiab lub sijhawm tiag tiag - cov ntaub ntawv tau txais cov txheej txheem siv cov qauv tsim tawm los txo cov khoom pov tseg thiab ua kom muaj txiaj ntsig zoo tshaj plaws. Los ntawm kev sib koom ua ke CNC machining thev naus laus zis, kev lag luam IoT, thiab kev tswj hwm lub tshuab ua haujlwm, peb ua tiav kev sib koom ua ke thiab kev sib koom ua haujlwm ntawm cov cuab yeej tsim khoom, yog li ua kom cov nyiaj txuag ntau lawm.
Cim npe nrov: Aluminium Nitride Ceramic Substrate, Aluminium Nitride Ceramic Substrate manufacturers, lwm tus neeg, Hoobkas
